Products

Products

Thin Film Ceramic Submounts

Features

  • Wide thickness range: 0.10mm~1.50mm (0.004˝~0.060˝)
  • Thin film technology products
  • Ceramic substrate
  • Fit to gold wire bonding

Applications

Used for heat dissipation, support, gold bonding and current circuit short.

  • RF/Microwave/Millimeter wave communication
  • Optical communication 
  • LED heat dissipation submount

Customer designed

ceramic submounts

Submount Figuration

Selection Guide

  ★TABLE 4-1 Length & width code                              Unit: mm (inch)

Size code202530354050
L0.508±0.051(0.020±0.002)0.635±0.051(0.025±0.002)0.762±0.051(0.030±0.002)0.889±0.051(0.035±0.002)1.012±0.076(0.040±0.003)1.270±0.076(0.050±0.003)
W0.508±0.051(0.020±0.002)0.635±0.051(0.025±0.002)0.762±0.051(0.030±0.002)0.889±0.051(0.035±0.002)1.012±0.076(0.040±0.003)1.270±0.076(0.050±0.003)

                 ★TABLE 4-2 Thickness code                                Unit: mm (inch)

Size code123456
T0.127±0.051(0.005±0.002)0.254±0.051(0.010±0.002)0.381±0.051(0.015±0.002)0.508±0.051(0.020±0.002)0.635±0.051(0.025±0.002)Other

★ Customer designed resistors are available

Part Number Code

PartSignificationDetail
= subMount M
Figuration Code4.3
Length CodeTABLE 4-1
Materials CodeAAlumina Al2O3
  BAluminum Nitride AlN
  NBeryllia BeO
Width CodeTABLE 4-1
Thickness CodeTABLE 4-2
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